Teledyne e2v HiRel and Integra Technologies Inc. partner on high voltage GaN devices


Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced a new high reliability partnership with California-based Integra Technologies, Inc. (Integra). Under the new agreement, Teledyne will leverage Integra’s portfolio of GaN on SiC RF power transistor products to deliver optimized power solutions for the space market.

With Integra, Teledyne e2v HiRel will specialize in providing high power RF devices for emerging space applications in the LEO and GEO payload market. Teledyne will also offer high reliability options for Integra's popular GaN on SiC power devices and pallets targeted at the defense market.

“Our space customers are requesting RF power devices at higher power density levels and operating at higher frequencies,” said Brad Little, VP and General Manager of Teledyne e2v HiRel. “The combination of our expertise in providing space RF components along with Integra’s high performance RF GaN device technology and product portfolio will provide space payload engineers state-of-the-art power devices for insertion in their applications.”

"Integra has decades of proven success enabling a variety of defense and commercial radar systems with our world class RF power products,” said Suja Ramnath, CEO of Integra. “We are excited to partner with Teledyne e2V, a market leader in hi-rel with deep domain expertise, to extend the application of our unique GaN on SiC technology and products into the growing space market."

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